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The module technology proposed in this paper is used to fabricate a wire embedded ethyl vinyl acetate (EVA) sheet module by applying a cell/module integrated process in which the cell and wire are bonded during the lamination process. A wire-embedded EVA sheet module was fabricated using a busbarless cell and SnBiAg wire. As a result of the module characteristics corresponding to the lamination process temperature, the highest efficiency of 19.55% was observed at 170 °C. The lowest contact resistivity between the wire and the finger electrode was shown under a temperature condition of 170 °C, which was confirmed to increase the efficiency owing to an improvement of the fill factor with an excellent electrical contact.
18.3 Gibbs Free Energy and the Relationship between Delta G, Delta
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